Bob Patti On 3D Chips

We like Bob Patti, he's the CEO of Tezzaron and also on our Board of Advisors. Check out this article referenced in Wikipedia, written by Bob, called "Impact of Wafer-Level 3D Stacking on the Yield of ICs" (subscription required).

To take advantage of process separation, a 3D DRAM chip would be designed with all its bit cells on separate layers from its support circuitry. The processing of the two types of layers, on their separate wafers, would be very different – each process highly optimized for its contents.