R3Logic Joins The Blogosphere

Our CEO here at R3Logic, Lisa McIlrath, has been globe-trotting, giving presentations, making speeches and meeting great people across this country and abroad, so we figured it was high time to know more about her and her start-up. We make software that allows people to design 3D chips quickly and easily. More soon from our HQ in Waltham, MA.

Bob Patti On 3D Chips

We like Bob Patti, he's the CEO of Tezzaron and also on our Board of Advisors. Check out this article referenced in Wikipedia, written by Bob, called "Impact of Wafer-Level 3D Stacking on the Yield of ICs" (subscription required).

To take advantage of process separation, a 3D DRAM chip would be designed with all its bit cells on separate layers from its support circuitry. The processing of the two types of layers, on their separate wafers, would be very different – each process highly optimized for its contents.

What The Heck Are 3D Chips Anyway?

If you've heard about 3D chips and wondered what all the fuss about them is, let's see what Wikipedia has to say for starters:

In electronics, a three-dimensional integrated circuit (3D IC, 3D-IC, or 3-D IC) is a chip with two or more layers of active electronic components, integrated both vertically and horizontally into a single circuit. The semiconductor industry is hotly pursuing this promising technology in many different forms, but it is not yet widely used; consequently, the definition is still somewhat fluid.

Here's the link to Wikipedia for more on this subject.